G-SN-C2 II Laser 3D/2D Subsurface Engraving Machine is a new laser processing equipment that combines laser technology, computer technology and integrates optics, machiney and electronic.

It adopts pulse laser and focuses it inside transparent materials to produce nanometer points of vaporous burst. Because the points can constitute splendid picture, pattern, and words inside glass controlled by computer, ordinary transparent materials can be made into grade luxurious art wares.

Our series laser subsurface engraving machine usually fit to glass decoration industry, crystal gift industry, glass gift industry, glass and Plexiglas signs industry. It can also be used in secondary process industry of all kinds of bottles and other transparent materials

Specification:

Laser Medium: Diode Pump
Cooling system: Air cooler
Laser Wavelength: 532nm
Engraving frequency: 2 KHz
Pulse Width: 7ns
Single Point Power : 1.2MJ
Quality of Laser Beam: TEMoo M2<1.5
Resolution: 500 Dpi
Engraving Dimension 
Type C1: Max 160mm*160mm*100mm
Type C2: Max 190mm*160mm*100mm
Engraving speed: 1500 dots/second
Input Power Standard: 220V/110V, 50HZ
Power Consumption: 0.6KW
Dimension of Mainframe 
Option C1/ C2(L*W*H): 760mm*560mm*560mm
Weight C1/ C2: 65 KG